Semiconductor parts machining
The field of semiconductors and electronics requires high precision and reliability, and its cutting-edge technology-intensive characteristics are particularly obvious, with high precision, small batch size, multiple varieties, special sizes, complex processes, extremely demanding, etc.
Examples of semiconductor parts machining
Encapsulation mould barrels
Packaging Die Parts
Ceramic Wafers
Ceramic Handlers
Male nuts
Female caps
Reducing unions
Male plugs
Gaskets
Aerospace Parts Manufacturing Technology
Semiconductors part manufacturing technology
Technical ceramic machining of diameters up to 650 mm and lengths up to 400 mm are possible.
Custom carbide parts
The company supplies components for semiconductor packaging moulds, generally consisting of carbide machined barrels and plugs
Crystalline material machining
The company is a manufacturer of sapphire substrates, vacuum suction cups, heaters and wafer handling arms for semiconductors.
Semiconductor parts case
Machining of carbide barrels and plunger rods for semiconductor packaging moulds.
Machining of carbide barrels and plunger rods for semiconductor packaging moulds.
Zirconia ceramic handlers and alumina ceramic wafers are used in the semiconductor sector.
Manufacturer of technical ceramic alumina and zirconia, silicon carbide wafers.
SPP Industry Ltd.
In the 1990s, SPP Industry Ltd was one of the first manufacturers to establish CNC machining in China. The company has now established five major machine parks in China, with significant achievements in the areas of 5-axis machining, precision grinding & honing, gear machining, large parts machining, custom tungsten carbide and new material development respectively.
