Auto Mold & Chase and Conversion Kit
-All kinds of automold chases
-All kinds of full conversion kits for auto mold system
-Solution for venting and gating design to ensure good moldability performance (Void, Wire Sweep and incomplete filling)
-Standard Cavity Bar Material : ASP23
-Convertible Mold Die for other package type
-Minimized compound usage Automold Conversion Kits
-All kinds of full conversion kits for auto molding system
Custom Machining Pot & Plunger for Semiconductor Packaging
The company is one of the largest manufacturers of Pot & Plunger in China and we provide OEM services for Pot & Plunger to well-known semiconductor companies in China and Taiwan.
Pot & Plunger is used in the manufacture of semiconductor packaging moulds. The company's Pot & Plunger can be manufactured using M42 high speed steel or tungsten carbide and can also be supplied with additional PVD coating services.
IC Packaging Mold Cavity Bar and Auto Mold Chase
Application: Suitable for TOWA, FICO, ASM, HANMI brand AUTO MOLD SYSTEM
Can be used in conjunction with automatic encapsulation systems to improve the intrinsic quality of the product.
Lead Frame Tooling & Stamping Die Parts
SPP INDUSTRY manufactures a variety of leadframes using ultra-precision tooling by stamping and etching, and provides OEM services for high-precision tooling components.
OEM/ODM Punches and IC Die Pins for Semiconductors
Precision stamping die components are used in the semiconductor field. Punches and IC die pins are finished with tungsten carbide or hardened tool steel, and additional PVD coating services are also available. SPP INDUSTRY's die components are 6 times more durable than ordinary die standard parts, which is one of our patented products.
Pot,Plunger, Gate Insert for Semiconductor Dies
We have customized IC die pins for semiconductor test equipment (IC testers) and our highest priority is to provide our customers with comprehensive technical, engineering and manufacturing support for all your connection needs.
We also offer the widest range of suction cups for your automation solutions. Including custom suction cups to fit your specific application.
-punches and pins
Semiconductor Components and Tooling Manufacturer
We are a manufacturer of semiconductor components and tooling, providing high precision OEM parts services, including tungsten carbide punches, package mold cartridges and plungers, leadframe stamping mold parts, IC hot runner gate parts, etc.
Semiconductor Leadframe Mould & Die Tooling Machining
Semiconductor leadframe moulding A metal substrate that serves as a lead to connect a semiconductor chip to external circuitry and as a frame to hold a semiconductor package to a circuit board.
As a key component of a semiconductor integrated circuit, it is connected to the chip by thin leads and transmits electrical signals between the semiconductor chip and the substrate, and acts as a frame to protect and support the chip from external moisture or shocks.
Semiconductor Leadframe Tooling Stamping Punches
Many different types of leadframes are used in semiconductor devices, and SPP INDUSTRY designs and manufactures molds, assembles stamping dies, and mass produces and supplies a variety of high precision and quality leadframes and stamping die components.
Semiconductor MGP Mold Die Machining
Application: Mainly used for post-process packaging of integrated circuits and semiconductor devices.
Features: Multiple cans and plungers. Implementation of short filling distances.
Advantages: good plastic sealing process, packaging quality improvement; mould box with quick-change structure, easy to use and maintain.
Semiconductor Pot & Carbide Plunger Manufacturers
The company is a manufacturer of the semiconductor Pot & Plunger, which is finished in tungsten carbide and is manufactured and customised according to drawings
Semiconductor Tooling Manufacturer
The semiconductor tooling industry is one of our key markets. We have extensive experience in manufacturing tools for the back-end semiconductor industry, semiconductor packaging, semiconductor leadframes and more. From modules and fixtures for chip attachment to conversion kits for IC test processors to ceramic arms for wafer handling and package and leadframe die components, we have the skills and expertise to build your product to your exacting standards.