Pot & Plunge for Semiconductor Packaging Tooling
We supply mould components for semiconductor packaging, integrated circuits, they are completed with carbide, technical ceramics, hardened tool steel.
Typical products:
Strip Cavity
Pot & Plunger
Ejector Pins
Cavity QFP
Cavity - T2R
Cavity - SFLAT
Cavity - QFN
Cavity - ESOP
Tungsten Carbide Speciality Inserts
Mould Inserts
Punch & Matrix
Guidance elements, etc.
Semiconductor moulds are very demanding in terms of precision. SPP CNC MACHINING is used for DMG co-ordinate grinding machines and precision honing machines to complete the demanding requirements for semiconductor tools.
Whether it's a complete set of semiconductor package moulds, rib cutting moulds, plastic moulds or mould replacement parts, we can do it all.
Manufacture of semiconductor mould components and tooling according to drawings
Areas of application:
Semiconductor manufacturing
Integrated Circuits
Packaging
Tendon cutting, etc.
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SPP Industry Ltd.
In the 1990s, SPP Industry Ltd was one of the first manufacturers to establish CNC machining in China. The company has now established five major machine parks in China, with significant achievements in the areas of 5-axis machining, precision grinding & honing, gear machining, large parts machining, custom tungsten carbide and new material development respectively.
