IC Packaging Mold Cavity Bar and Auto Mold Chase
Application: Suitable for TOWA, FICO, ASM, HANMI brand AUTO MOLD SYSTEM
Can be used in conjunction with automatic encapsulation systems to improve the intrinsic quality of the product.
We manufacture AUTO MOLD for semiconductor packaging moulds and offer the manufacture of special parts for moulds.
-MOLD CHASE
-IC packing molds
-Cavity bar
-BTM cavity block
-DIP sliding cover
-Runner plate
-Base of BTM cavtiy bar
-Auto mold chase
-QFN package mold insert
-Molded insert TO247
-SOT mold for semiconductor packaging
-Molded insert for semiconductor packaging die (top)
-Forming cavity (insert) under semiconductor package
-Mould inserts
-Molded insert in semiconductor package (TO92)
-Die box for mould sealing of semiconductor and integrated circuit
-Semiconductor gate runner mold
-Gate runner mold etc.
Manufacture of semiconductor tools from drawings
Semiconductor Manufacturing
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Semiconductor MGP Mold Die Machining
Application: Mainly used for post-process packaging of integrated circuits and semiconductor devices.
Features: Multiple cans and plungers. Implementation of short filling distances.
Advantages: good plastic sealing process, packaging quality improvement; mould box with quick-change structure, easy to use and maintain.
Semiconductor Components and Tooling Manufacturer
We are a manufacturer of semiconductor components and tooling, providing high precision OEM parts services, including tungsten carbide punches, package mold cartridges and plungers, leadframe stamping mold parts, IC hot runner gate parts, etc.
Custom Machining Pot & Plunger for Semiconductor Packaging
The company is one of the largest manufacturers of Pot & Plunger in China and we provide OEM services for Pot & Plunger to well-known semiconductor companies in China and Taiwan.
Pot & Plunger is used in the manufacture of semiconductor packaging moulds. The company's Pot & Plunger can be manufactured using M42 high speed steel or tungsten carbide and can also be supplied with additional PVD coating services.Semiconductor Leadframe Mould & Die Tooling Machining
Semiconductor leadframe moulding A metal substrate that serves as a lead to connect a semiconductor chip to external circuitry and as a frame to hold a semiconductor package to a circuit board.
As a key component of a semiconductor integrated circuit, it is connected to the chip by thin leads and transmits electrical signals between the semiconductor chip and the substrate, and acts as a frame to protect and support the chip from external moisture or shocks.
SPP Industry Ltd.
In the 1990s, SPP Industry Ltd was one of the first manufacturers to establish CNC machining in China. The company has now established five major machine parks in China, with significant achievements in the areas of 5-axis machining, precision grinding & honing, gear machining, large parts machining, custom tungsten carbide and new material development respectively.
