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Semiconductor MGP Mold Die Machining

Application: Mainly used for post-process packaging of integrated circuits and semiconductor devices.

Features: Multiple cans and plungers. Implementation of short filling distances.

Advantages: good plastic sealing process, packaging quality improvement; mould box with quick-change structure, easy to use and maintain.

SPP Industry Ltd.

In the 1990s, SPP Industry Ltd was one of the first manufacturers to establish CNC machining in China. The company has now established five major machine parks in China, with significant achievements in the areas of 5-axis machining, precision grinding & honing, gear machining, large parts machining, custom tungsten carbide and new material development respectively.

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