Semiconductor MGP Mold Die Machining
Application: Mainly used for post-process packaging of integrated circuits and semiconductor devices.
Features: Multiple cans and plungers. Implementation of short filling distances.
Advantages: good plastic sealing process, packaging quality improvement; mould box with quick-change structure, easy to use and maintain.
Applicable package types:
1. QFP, LQFP, TSOP, PLCC, SOT, SOD series;
2. Matrix SOP, SSOP, TSSOP series;
3. SMD tantalum, SMD sensing and DIP, TO, etc. with high requirements;
4.DIP and SDIP series
Application: mainly used for post-process packaging of integrated circuits and semiconductor devices.
Features: Multi-can and multi-plunger. Implementation of short filling distances.
Advantages: good plastic sealing process, packaging quality improvement; mould box with quick-change structure, easy to use and maintain.
-. Balanced filling and high quality
-. Quick-change moulded parts
-. Fast curing compounds use
-. Suitable for all types of packaging
-. Solutions for venting and gate design to ensure good moulding
performance (voids, swept lines and incomplete filling).
-. Minimising the use of compounds
-. Individual chasing X-Y positioners on the top and bottom four sides
-. Standard material: ASP23
-. Pot and plunger head: T.C
-. Chase interlock design: Misalignment <1.5
-. T.C Gate insertion design
-. E-J pins without crown flash
-. Heat loss cover: Teflon cloth (blanket) / DuPont Nomex - T994
For semiconductor manufacturing
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In the 1990s, SPP Industry Ltd was one of the first manufacturers to establish CNC machining in China. The company has now established five major machine parks in China, with significant achievements in the areas of 5-axis machining, precision grinding & honing, gear machining, large parts machining, custom tungsten carbide and new material development respectively.
