Semiconductor Leadframe Tooling Stamping Punches
Many different types of leadframes are used in semiconductor devices, and SPP INDUSTRY designs and manufactures molds, assembles stamping dies, and mass produces and supplies a variety of high precision and quality leadframes and stamping die components.
The company is a manufacturer of semiconductor leadframes and we are also one of the largest manufacturers of leadframe stamping tooling components in China.
Punching widths as small as 50 μm
The stamping tooling is a clever assembly of self-developed high-precision parts.
SPP INDUSTRY meets all customer needs with advanced tooling development/manufacturing and mass production stamping technology.
For all your leadframe needs
LSI, transistors and diodes.
Leadframes for semiconductor devices are becoming more and more diverse and complex. At SPP INDUSTRY, we handle everything from mold design and manufacturing to assembly and leadframe production for volume production, and provide mold component manufacturing services for leadframes.
Manufacture leadframes and semiconductor leadframe mold parts according to drawings
Leadframes for semiconductors such as LSIs, transistors, and diodes.
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Semiconductor MGP Mold Die Machining
Application: Mainly used for post-process packaging of integrated circuits and semiconductor devices.
Features: Multiple cans and plungers. Implementation of short filling distances.
Advantages: good plastic sealing process, packaging quality improvement; mould box with quick-change structure, easy to use and maintain.
Semiconductor Tooling Manufacturer
The semiconductor tooling industry is one of our key markets. We have extensive experience in manufacturing tools for the back-end semiconductor industry, semiconductor packaging, semiconductor leadframes and more. From modules and fixtures for chip attachment to conversion kits for IC test processors to ceramic arms for wafer handling and package and leadframe die components, we have the skills and expertise to build your product to your exacting standards.
Semiconductor Leadframe Mould & Die Tooling Machining
Semiconductor leadframe moulding A metal substrate that serves as a lead to connect a semiconductor chip to external circuitry and as a frame to hold a semiconductor package to a circuit board.
As a key component of a semiconductor integrated circuit, it is connected to the chip by thin leads and transmits electrical signals between the semiconductor chip and the substrate, and acts as a frame to protect and support the chip from external moisture or shocks.
SPP Industry Ltd.
In the 1990s, SPP Industry Ltd was one of the first manufacturers to establish CNC machining in China. The company has now established five major machine parks in China, with significant achievements in the areas of 5-axis machining, precision grinding & honing, gear machining, large parts machining, custom tungsten carbide and new material development respectively.
