Semiconductor Tooling Manufacturer
The semiconductor tooling industry is one of our key markets. We have extensive experience in manufacturing tools for the back-end semiconductor industry, semiconductor packaging, semiconductor leadframes and more. From modules and fixtures for chip attachment to conversion kits for IC test processors to ceramic arms for wafer handling and package and leadframe die components, we have the skills and expertise to build your product to your exacting standards.
We are one of the leading manufacturers of semiconductor tooling, be it carbide, technical ceramics, hardened tool steel or other materials. We can customize and OEM semiconductor tools completely on demand and according to drawings.
OEM and ODM semiconductor tooling and die components
Our OEM semiconductor components and tooling are widely used in:
-Semiconductor
-Wafer Fabrication
-Leadframe
-Semiconductor packaging and other fields.
Related products
Auto Mold & Chase and Conversion Kit
Automold Chase
-All kinds of automold chases
-All kinds of full conversion kits for auto mold system
-Solution for venting and gating design to ensure good moldability performance (Void, Wire Sweep and incomplete filling)
-Standard Cavity Bar Material : ASP23
-Convertible Mold Die for other package type
-Minimized compound usage Automold Conversion Kits
-All kinds of full conversion kits for auto molding system
Pot,Plunger, Gate Insert for Semiconductor Dies
We have customized IC die pins for semiconductor test equipment (IC testers) and our highest priority is to provide our customers with comprehensive technical, engineering and manufacturing support for all your connection needs.
We also offer the widest range of suction cups for your automation solutions. Including custom suction cups to fit your specific application.
-pot, plunger
-gate insert
-punches and pins
IC Packaging Mold Cavity Bar and Auto Mold Chase
Application: Suitable for TOWA, FICO, ASM, HANMI brand AUTO MOLD SYSTEM
Can be used in conjunction with automatic encapsulation systems to improve the intrinsic quality of the product.Semiconductor Leadframe Mould & Die Tooling Machining
Semiconductor leadframe moulding A metal substrate that serves as a lead to connect a semiconductor chip to external circuitry and as a frame to hold a semiconductor package to a circuit board.
As a key component of a semiconductor integrated circuit, it is connected to the chip by thin leads and transmits electrical signals between the semiconductor chip and the substrate, and acts as a frame to protect and support the chip from external moisture or shocks.
SPP Industry Ltd.
In the 1990s, SPP Industry Ltd was one of the first manufacturers to establish CNC machining in China. The company has now established five major machine parks in China, with significant achievements in the areas of 5-axis machining, precision grinding & honing, gear machining, large parts machining, custom tungsten carbide and new material development respectively.
