Semiconductor Leadframe Mould & Die Tooling Machining
Semiconductor leadframe moulding A metal substrate that serves as a lead to connect a semiconductor chip to external circuitry and as a frame to hold a semiconductor package to a circuit board.
As a key component of a semiconductor integrated circuit, it is connected to the chip by thin leads and transmits electrical signals between the semiconductor chip and the substrate, and acts as a frame to protect and support the chip from external moisture or shocks.
The company has 22 years of experience in the manufacture of semiconductor moulded components. We manufacture precision components such as semiconductor leadframe moulds, semiconductor packaging moulds, semiconductor POT & PLUNGER, semiconductor hot runner cavities, semiconductor stamping moulds and semiconductor injection moulding from drawings.
Semiconductor mould component materials:
-Carbide
-Technical ceramics
-Hardened tool steel
etc.
Manufacture of semiconductor leadframe moulds from drawings
Application areas for semiconductor leadframe moulds:
-Semiconductor manufacturing
-Wafer manufacturing
-Semiconductor packaging components
-Semiconductor integrated circuit components, etc.
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