Semiconductor Leadframe Mould & Die Tooling Machining
Semiconductor leadframe moulding A metal substrate that serves as a lead to connect a semiconductor chip to external circuitry and as a frame to hold a semiconductor package to a circuit board.
As a key component of a semiconductor integrated circuit, it is connected to the chip by thin leads and transmits electrical signals between the semiconductor chip and the substrate, and acts as a frame to protect and support the chip from external moisture or shocks.
The company has 22 years of experience in the manufacture of semiconductor moulded components. We manufacture precision components such as semiconductor leadframe moulds, semiconductor packaging moulds, semiconductor POT & PLUNGER, semiconductor hot runner cavities, semiconductor stamping moulds and semiconductor injection moulding from drawings.
Semiconductor mould component materials:
-Carbide
-Technical ceramics
-Hardened tool steel
etc.
Manufacture of semiconductor leadframe moulds from drawings
Application areas for semiconductor leadframe moulds:
-Semiconductor manufacturing
-Wafer manufacturing
-Semiconductor packaging components
-Semiconductor integrated circuit components, etc.
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The company is one of the largest manufacturers of Pot & Plunger in China and we provide OEM services for Pot & Plunger to well-known semiconductor companies in China and Taiwan.
Pot & Plunger is used in the manufacture of semiconductor packaging moulds. The company's Pot & Plunger can be manufactured using M42 high speed steel or tungsten carbide and can also be supplied with additional PVD coating services.
SPP Industry Ltd.
In the 1990s, SPP Industry Ltd was one of the first manufacturers to establish CNC machining in China. The company has now established five major machine parks in China, with significant achievements in the areas of 5-axis machining, precision grinding & honing, gear machining, large parts machining, custom tungsten carbide and new material development respectively.
